词语吧>英语词典>soldering翻译和用法

soldering

英 [ˈsəʊldəɪŋ]

美 [ˈsɑːdərɪŋ]

v.  焊接; 焊合
solder的现在分词

现在分词:soldering 

计算机化学

BNC.46499 / COCA.35943

柯林斯词典

  • VERB 焊;焊接;焊合
    If yousoldertwo pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so that it holds them together after it has cooled.
    1. Fewer workers are needed to solder circuit boards...
      焊接电路板需要的工人更少了。
    2. He then soldered the wire to the telephone terminal...
      接着他把电话线焊接到电话机上。
    3. He cuts the pieces and solders them together.
      他把那些断片切碎,然后把它们焊在一起。
  • 焊料;焊锡
    Solderis the soft metal used for soldering.

    英英释义

    noun

    • fastening firmly together
        Synonym:bonding

      双语例句

      • The ultrasonic soldering process of aluminium heat exchangers and a few important factors effecting on the soldering are reviewed.
        论述了铝热交换器的超声波钎焊工艺及其影响钎焊的几个关键因素。
      • A mechanism is put forward of laser dip soldering of steel and cemented carbides.
        提出了钢浸润硬质合金的激光焊接机理。
      • Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
        本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
      • This paper deals with method of soldering thermoelectric cooler with metal dewar of infrared detector.
        本文论述了四级微型半导体致冷器与红外探测器金属杜瓦瓶的钎焊方法。
      • HOT BARThe hot wire is widely used in welding, solder reflow soldering.
        广泛应用于线材的热压焊、焊锡焊接的回流焊,IC贴片。
      • Tin-coat the plug-in contact before soldering.
        焊接之前必须给插入式触点涂上锡。
      • Resistance diffusing soldering of copper and mild steel Static contact Electrode shape Inserting solder Potential difference;
        铜与低碳钢电阻扩散焊;静触头;电极形状;嵌料;电位差;
      • Nitriding and oxidation: diffusion layer and oxidation layer improve soldering resistance, adhesion resistance and crack resistance.
        氮化扩散层和氧化层:可以提高模具耐溶损性、耐过烧性、耐粘着性和耐热裂性。
      • When installing solder end valves, conventional soldering techniques should be used.
        安装焊接连接端口的阀门时,应该采用普通焊接技术。
      • The molded package is compatible with lead-free IR ( infrared) soldering processes.
        这款模具封装技术与无铅红外线回流焊接工艺兼容。